Re: gEDA-user: Footprint naming convention

[Levente <levente.kovacs@xxxxxxxxxxxx>]

Hi,


I would prefer naming a footprint like footprintname_technology.fp For example
MSSOP28W_R.fp which means MSSOP28W soldered by reflow technology. Other
technologies may could apply like wave soldering (W), hand soldering (H).


andrewm <andrewm@xxxxxxxxxxxxxxx> wrote:
> John Luciani wrote:
>> On 9/1/07, andrewm <andrewm@xxxxxxxxxxxxxxx> wrote:
>>   
>>> I am presently drawing up footprints for my stock components.
>>>
>>> I have read the naming conventions for the footprints and have
>>> done some searches but can't find an answer to this query.
>>>
>>> I have for many components two different foot prints.  I would
>>> like to know if there is a convention to naming the multiples.
>>>
>>> I don't mean I have a device that comes in a DIP40 and also
>>> comes in a TQFP44.  I mean I wish to have two version of a
>>> MSSOP28W (0.65mm 28 lead 5.3mm wide package)
>>> footprint.
>>>
>>> I would like one version of the footprint following the
>>> manufacturer approved pin width/length.  I would also like
>>> another version with longer pins that I use in prototype
>>> boards that I will hand solder.
>>>     
>>
>> If you followed a manufacturer's specification I would use a suffix
>> that calls out the specific manufacturer and package
>> designation (e.g. "__TI_DRC_Package")
>>
>> IPC-7351 calls out an environment use suffix which you could probably use
>> for designating larger prototype pads. The "Most Material" condition
>> may work for
>> your prototype fooprints and the "Nominal Material" for a production process.
>>
>> M ... Most Material
>> N ... Nominal Material
>> L ... Least Material
>>
>> I am thinking of adding the suffixes "MM", "NM", "LM" to my naming convention
>> to correspond to the IPC-7351 material conditions.
>>
>> (* jcl *)
>>
>>   
> 
> Thanks John,
> 
> However the extra meat I put on some pads for prototype soldering is 
> well in excess of the IPC-7351 most material.
> 
> I think I will just pop a suffix on the back of them for my own use and 
> I shall never release the footprints to not confuse others.
> 
> 
> 
> 
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-- 
Levente
http://web.interware.hu/lekovacs



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