Re: gEDA-user: PCB: proposal for solder paste and adhesive spec in footprint

[John Griessen <john@xxxxxxxxxxxxxx>]

Dave N6NZ wrote:
> I keep revisiting the idea of adding better paste information to the 
> footprint. 
> I propose a "Dispense" keyword. 

[jg]Sounds good.  Compatible with any layout object oriented future 
developments.

> Form:
> Dispense [ x1 y1 x2 y2 volume "material" "flags" ]
[jg]Sounds good.  Compatible with current data file format, and any 
layout object oriented future developments.

the paste layer
> gerber should use the current method of simply copying the pad. 
> Otherwise the gerber hid should use a user-provided "stencil thickness" 
> to compute the aperture that yields the required volume.

[jg]If you want it to be "full auto" like this, it could be more 
complete, as in usng a field of dots for large pads...instead of a 
single aperture.  The handler plugin for this would check assertions 
about the size of pads and rules for how to achieve correct volume when 
specified.


John Griessen


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