Re: gEDA-user: a website write up of PCB history and current practice to note.

[DJ Delorie <dj@xxxxxxxxxxx>]

> He says he attempts to present the straight facts, so please do not
> attack if you see some point of difference, just point it out.
> He'll probably fix it pronto.

Overall pretty good as an overview.  Minor fixes:

Layers->Conductors

the photographic process is the most common, but not the only, method.

Big fabs normally use cupric chloride, not ferric chloride, to etch,
and it's not an acid (although the solution it's in is acidic).  It's
normally referred to as "the etchant".

Induction: capacitive or inductive coupling.

Tin-Lead Reflow:  Usually called HASL (hot air solder leveling)

Layout design - the old gerber 274D format has been replaced by the
new 274X format, which does not require a separate aperture list.


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