gEDA-user: Benefit of oval pads on component side?

[Stefan Salewski <mail@xxxxxxxxxxxx>]

Marcel Schmedes just posted this link

http://www.luciani.org/images/drawdio_r0_top.jpg

which reminds me to the question of the benefit of oval pads on the
component side for through hole parts like DIP. I can see the benefit on
the solder side, so my footprint generator has the option to make ovals
on the solder side for DIP and SIP, but not on component side. Do I miss
something (of course it's easy to add this feature).

Best regards

Stefan Salewski




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