Re: gEDA-user: Plastic Ball Grid Array (PBGA) packages?

[Karel Kulhavy <clock@xxxxxxxxxxxxx>]

On Fri, Dec 31, 2004 at 01:19:38PM -0500, M. P. Dickens wrote:
> FWIW, I deal with bga parts a lot. I'v tried several methods including
> hot air and all of them with the exception of one have been problematic.
> With hot air, you run the risk that the part will be moved as the air
> blows on the part and the solder paste begins to melt. Also, heating a
> board with hot air can seperate the layers in the board because 
> typically, one one side of the board is heated and the other side is not 
> (And stays cooler).
> 
> Anyway, the method I use give about a 95% success rate on high pitch,
> high ball count parts. The success rate is close to 100% with low ball
> count parts.
> 
> The setup I use consists of two dark IR heating elements. One is placed

What is dark IR? I know what IR is but don't know what a dark IR is.

Cl<