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Re: gEDA-user: PCB: possible thermal fix
Matthew N. Dodd wrote:
- All thermal "fingers" use DRC min-overlap rather than depending on
rounded line caps. Previously overlap was half of finger width. -
Thermal "fingers" observe DRC minimum line width.
- Additional fingers added (previous thermal pattern was 'x', added '+'
for final shape of '*')
The additional fingers may make the thermal less effective at allowing
soldering. Is there any way to have pins be a '+' and vias to be solid?
Comments? The last change isn't really necessary, though it might be
nice to allow for a variety of thermal styles, including "solid".
Solid would be extremely useful. I have had problems with thermal
fingers touching other vias in extremely dense boards. DRC does not
seem to catch this either. This is a problem under high pin count fine
pitch surface mount parts sometimes.
--
Darrell Harmon
100x100mm SBC running GNU/Linux:
http://dlharmon.com/sbc.html