Re: gEDA-user: PCB: possible thermal fix

["Matthew N. Dodd" <winter@xxxxxxxxx>]

On Tue, 15 Feb 2005, Darrell Harmon wrote:
> Solid would be extremely useful.  I have had problems with thermal 
> fingers touching other vias in extremely dense boards.  DRC does not 
> seem to catch this either.  This is a problem under high pin count fine 
> pitch surface mount parts sometimes.

The real problem is that thermal fingers are not cleared by lines, vias 
etc.  Thermal fingers should be treated like copper polygons.

I don't understand the code well enough to do this though.

It looks like thermal fingers are drawn after the layer mask has been 
applied to the layer and not before.

--
10 40 80 C0 00 FF FF FF FF C0 00 00 00 00 10 AA AA 03 00 00 00 08 00