Re: gEDA-user: Thermal via in pad

[Steve Meier <smeier@xxxxxxxxxxxxxxxxxxx>]

I think that this is a non-issue. I have built bords with these types of
vias in pads many times. Thermal shielding is more of an issue when you
are attempting to attach a device to a pad. In that case, you don't want
a via connecting directly to a large ground or power plane without
thermal relief as the plane would transfer and disipate the soldering
heat.

Steve Meier


On Thu, 2007-01-11 at 23:52 +0100, David Kuehling wrote:
> Hi,
> 
> I just noticed that punching a via into a large ground pad does not
> produce a non-copper (clearance) ring around the via, as it would do for
> vias inside polygons, see screenshot:
> 
> http://user.cs.tu-berlin.de/~dvdkhlng/via-in-pad.png
> 
> I guess such kind of via wouldn't be manufacturable since it isn't
> thermally shielded from the surrounding pad?
> 
> Or is it just a bad idea to connect die-attach-pads directly with vias?
> 
> David



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