Re: gEDA-user: Thermal via in pad

[David Kuehling <dvdkhlng@xxxxxx>]

>>>>> "Darrell" == Darrell Harmon <dlharmon@xxxxxxxxxxxx> writes:

> David Kuehling wrote:
[..]
>> Or is it just a bad idea to connect die-attach-pads directly with
>> vias?
>> 
>> David
>> 
> I assume this is an exposed pad type part. Most of these use the
> exposed pad either for a good RF ground or heatsink or both. Some I
> have used call for a matrix of vias in the pad (one called for 64 15
> mil vias). For hand soldering, I usually do a large hole in the middle
> so I can solder the exposed pad and a ring of small vias around the
> edge. For reflow, just the matrix of vias with no thermal (not on the
> ground plane it connects to either).

This somehow seems to violate my manufacturer's design rules.  Minimum
hole size is .3mm anyways.  I always thought that vias absolutely need
thermals to connect to planes.  How do I connect a via without thermal?
Just set the clearance to 0?

David
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