I assume this is an exposed pad type part. Most of these use the exposed pad either for a good RF ground or heatsink or both. Some I have used call for a matrix of vias in the pad (one called for 64 15 mil vias). For hand soldering, I usually do a large hole in the middle so I can solder the exposed pad and a ring of small vias around the edge. For reflow, just the matrix of vias with no thermal (not on the ground plane it connects to either).Hi,
I just noticed that punching a via into a large ground pad does not produce a non-copper (clearance) ring around the via, as it would do for vias inside polygons, see screenshot:
http://user.cs.tu-berlin.de/~dvdkhlng/via-in-pad.png
I guess such kind of via wouldn't be manufacturable since it isn't thermally shielded from the surrounding pad?
Or is it just a bad idea to connect die-attach-pads directly with vias?
David
Darrell Harmon
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