The technical builtine from TI about reworking boards with this chip claims, that the part will self-align from tension as long as the offset is less than half the pitch in reflow, regardless of PB or RoHS process. When hand soldering I'd say place as exact as possible since the spot-heat will not allow the part to move, once it's soldered at a corner. Just reasoning without experience on this part... John Griessen wrote:
Mark Rages wrote:On Fri, Jul 16, 2010 at 1:35 PM, Armin Faltl <armin.faltl@xxxxxx> wrote:It has the pins beneath the package. I'll extend the pads about 0.5mm outside (longer with traces attached) as recommended, so will this trick work again? Regards, ArminOh, those (QFN-like) packages are quite easy to hand solder, except for the thermal pad underneath. Much easier than fragile narrow-pitch TQFP and TSSOP parts.Is there any chance of getting them to align from surface tension, or do you align it just right and then flow/solidify one side for hand soldering? Sounds like some downward pressure on the CS package would be good, right? John Griessen _______________________________________________ geda-user mailing list geda-user@xxxxxxxxxxxxxx http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
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