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gEDA-user: chip scale package soldering (was: dxf again)

Mark Rages wrote:

On Fri, Jul 16, 2010 at 1:35 PM, Armin Faltl <armin.faltl@xxxxxx> wrote:


It has the pins beneath the package. I'll extend the pads about 0.5mm
outside (longer
with traces attached) as recommended, so will this trick work again?

Regards, Armin



Oh, those (QFN-like) packages are quite easy to hand solder, except
for the thermal pad underneath.   Much easier than fragile
narrow-pitch TQFP and TSSOP parts.


Is there any chance of getting them to align from
surface tension, or do you align it just right
and then flow/solidify one side for hand soldering?  Sounds like some
downward pressure on the CS package would be good, right?

John Griessen


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