BTW, to move parts of this size controlled I made a tool consisting of a steel-needle and a pencile-size round wooden handle: the tip of the needle is cone-frustum shaped with an end-diameter of about 0.3mm. By placing near the part and roling on the tip I can push the part around, eliminating the shake of my hand. John Griessen wrote:
Mark Rages wrote:On Fri, Jul 16, 2010 at 1:35 PM, Armin Faltl <armin.faltl@xxxxxx> wrote:It has the pins beneath the package. I'll extend the pads about 0.5mm outside (longer with traces attached) as recommended, so will this trick work again? Regards, ArminOh, those (QFN-like) packages are quite easy to hand solder, except for the thermal pad underneath. Much easier than fragile narrow-pitch TQFP and TSSOP parts.Is there any chance of getting them to align from surface tension, or do you align it just right and then flow/solidify one side for hand soldering? Sounds like some downward pressure on the CS package would be good, right? John Griessen _______________________________________________ geda-user mailing list geda-user@xxxxxxxxxxxxxx http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
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