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Re: gEDA-user: chip scale package soldering (was: dxf again)

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Subject: Re: gEDA-user: chip scale package soldering (was: dxf again)
From: DJ Delorie <dj@xxxxxxxxxxx>
Date: Fri, 16 Jul 2010 18:03:04 -0400
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In-reply-to: <AANLkTinx_XRVRJEFPsGjOmrTfMloTbdobmjjKhvv7J3n@xxxxxxxxxxxxxx> (message from Bob Paddock on Fri, 16 Jul 2010 17:57:26 -0400)
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I usually scrape the no-clean flux off boards, because no-clean flux
between D- and D+ on a USB line will cause it to malfunction.  It's on
the order of 100k ohms at that point even for short traces, which is
significant.

OTOH I don't want to *have* to clean water-soluble off, esp under
chips.


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- Re: gEDA-user: chip scale package soldering (was: dxf again)
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