Re: gEDA-user: [pcb] overlapping pin/pad -- won't form thermal

[Steve Meier <smeier@xxxxxxxxxxxxxxxxxxx>]

I am also interested in why you would want a thermal for connecting a
via onto a pad in which the via is sitting.

I have used vias in pads twice now.

1) High density bga with a minimal number of layers. number of layers is
no longer an issue with pcb.
2) Conducting heat away from a component and into a power or ground
layer. For this case a thermal would be counter productive.

Steve Meier

DJ Delorie wrote:
> pcb doesn't support thermals on pads.
>
>
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