[Author Prev][Author Next][Thread Prev][Thread Next][Author Index][Thread Index]

Re: gEDA-user: How do you create soldermask?



On Sun, 23 May 2004 11:32:14 -0400
Bob Paddock <bpaddock@csonline.net> wrote:

> On Sunday 23 May 2004 10:14 am, Stephen Meier wrote:
> 
> > Look at my document www.meierrippin.com/pcb_landpattern_design.pdf
> 
> I have done so, does it needed updated to reflect the high resultion version 
> of PCB from CVS?

No.

> My ~gEDA/0805 footprint looks like this, which has a lot more zeros than your 
> examples:
> 
> Element[0x00000000 "0805" "R104" "10k" 197500 35000 -27500 -2500 0 100 
> 0x00000000]
> (
> 	Pad[-1700 -3200 1700 -3200 3600 3000 3600 "1" "1" 0x00000100]

-1700: x1
-3200: y1
1700:  x2
-3200: y2
3600:  36 mil thickness, analgous to pin diameter
3000:  30 mil clearance from any polygon
3600:  36 mil solder mask, same size as pad

Note that the solder mask is the same size as the pad. Turn off the pins/pads to
see the mask or produce a gerber file and view it.

The last time I had a board done the fab shop required at least a 3 mil "solder
mask relief". The above definition has no solder mask relief as the mask is the
same size as the pad. I started developing scripts to change the relief to 3 mil
on all elements but haven't completed it yet.  Maybe there is a better way.

<snip>

David