gEDA-user: SMT/Through Hole Mix

["Mike Hansen" <mehansen10@xxxxxxxxxxx>]

I have a design that's very low production quantity(~50 pieces per year) 
that has a couple of chips that only come in surface mount versions.   Does 
anyone have any opinions on what the lowest cost assembly option is with the 
design, is it better to attempt to do the whole board in SMT with just a few 
components through hole(things like power components) or do you do the board 
mostly through hole except the 2 surface mount chips(noting that one is 48 
pin tqfp).  Or do you go with two boards, one with all surface mount(except 
for perhaps the connector between the boards) and then do a second board 
with all the through hole components.

We've managed to keep things strictly through hole until this point in time. 
Unfortunately it's no longer viable to go all through hole with new designs 
of any complexity.

I appreciate any opinions.

Thanks