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Re: gEDA-user: Want to Use TI's symbols, footprints
On Thu, Nov 13, 2008 at 1:45 PM, Ethan Swint <eswint.ramu@xxxxxxxxxxx> wrote:
> do the TI footprints that involve thermal pads fall within the
> IPC definitions?
I have a few of the TI footprints with thermal pads at luciani.org ---
HTSSOP-65P-810L1-28N-420LT-770WT__TI_PowerPAD_Package
HTSSOP-65P-810L1-30N-420LT-900WT__TI_PowerPAD_Package
HTSSOP-65P-810L1-32N-420LT-900WT__TI_PowerPAD_Package
HTSSOP-65P-810L1-38N-420LT-1050WT__TI_PowerPAD_Package
SON-50P-380L1-10N-240WT-165LT__TI_DRC_Package.fp
SON-50P-380L1-10N-240WT-165LT__TI_DRC_Package.sfp (stencil footprint)
SON-65P-280L1-6N-160WT-100LT__TI_DRV_Package.fp
SON-65P-380L1-8N-240WT-150LT__TI_DRB_Package.fp
(* jcl *)
--
http://www.luciani.org
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