Re: gEDA-user: plated mounting holes

[Ethan Swint <eswint.ramu@xxxxxxxxxxx>]

On 10/23/2009 05:58 AM, gene glick wrote:
> How can I make a mounting hole that does:
> 1. top/bottom side plated round pad, e.g. .250"
> 2. connected from top to bottom with a plated hole
> 3. inner layer clearance is just the normal clearance around the hole,
> say .010"
>
>    
Presently, PCB can't do different pads on different layers.  I can think 
of two ways to do this:
1) Make a via with no pad, then make a solid thermal to a polygon which 
approximates a circle on top and both.  Finally, an arc trace can cover 
over the jagged edges.
2) Make an element with two rounded pads, same location, but one with 
the flag "onsolder".  Then put a pin through that has zero (or minimal) pad.

-Ethan
> I tried a large via, but the inner layer clearance is the clearance of
> the surface pad leaving a really big copper-free section on the inner
> layers.
>
> I suppose creating to elements, one for the top-side and another for the
> bottom, connected with a via of the proper hole size would work.  Seems
> there's another way, though?
>
>
> gene
>
>
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>
>    



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