Re: gEDA-user: PCB+GL testing

[Peter Clifton <pcjc2@xxxxxxxxx>]

On Fri, 2009-10-23 at 17:36 -0400, Mark wrote:
> On Fri October 23 2009 11:45:29 am Peter Clifton wrote:
> >
> > I bet it wouldn't be _that_ hard to add supports for pad thermals -
> > assuming the pad is rectangular. I've just checked, and noted that some
> > of our existing thermal styles don't work so well when the pin is
> > octagonal. (That's another little known PCB flag):
> 
> Hm, I wonder about that.  When I look at a board with the GL_3D I can see that the pads have a 
> different Z-depth than the component layer.  Is that something you chose to do or is there actually 
> a difference?

Just something I chose to do - probably in error. I was checking the
draw routines worked on all layers, so a gap helped me check.

The latest visualisation I was playing with dropped any extra depth for
the surface pads / pins, keeping them on the top copped / bottom layers
- just adjusting their drawn colour to be the "pad" colour, rather than
the layer colour.





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