Re: gEDA-user: PCB+GL testing

[Mark <mstanley@xxxxxxxxxxxxxxxx>]

On Fri October 23 2009 11:45:29 am Peter Clifton wrote:
>
> I bet it wouldn't be _that_ hard to add supports for pad thermals -
> assuming the pad is rectangular. I've just checked, and noted that some
> of our existing thermal styles don't work so well when the pin is
> octagonal. (That's another little known PCB flag):

Hm, I wonder about that.  When I look at a board with the GL_3D I can see that the pads have a 
different Z-depth than the component layer.  Is that something you chose to do or is there actually 
a difference?

-Mark Stanley


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