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Re: gEDA-user: plated mounting holes
On Fri, 23 Oct 2009 15:24:15 -0400, DJ Delorie wrote:
> Draw a smaller via (the inner layer diameter).
>
> Set your LINE width to the larger size, draw a line from the via to
> somewhere else.
>
> Move the "other" end of that new line back to the via, leaving a large
> round copper "line" on top of the via.
This large round copper line would be covered with solder mask - probably
not the desired behavior. Of course you can set the mask clearance of
the via to the large diameter. But then you get the same clearance on the
bottom side, too.
---<(kaimartin)>----
--
Kai-Martin Knaak
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