Re: gEDA-user: RFC --- Land Pattern (Footprint) Names

[John Luciani <jluciani@xxxxxxxxx>]

Thanks for the reply.

After reading the second point (again) I think it needs to be
clarified. The point I wanted to make is that footprint names that
contain only an industry standard body size specification (0805, 0603,
etc.) are not used.

The footprint names for chip resistors, chip capacitors and chip
inductors would be:

  resistor footprint  = RESC + body size specification
  capacitor footprint = CAPC + body size specification
  inductor footprint  = INDC + body size specification

Three different footprint names for the same body size specification.

I will rewrite the second point when I update the document.

Thanks.

(* jcl *)


On 9/6/05, Dan McMahill <dan@xxxxxxxxxxxx> wrote:
> John Luciani wrote:
> >   I have placed a first draft of my land pattern naming convention at
> > http://www.luciani.org
> > The naming convention is based on IPC-7351.
> >
> > Please send questions, comments, observations either to the list or to
> > (jluciani) *AT* gmail.com
> > (as appropriate).
> >
> > (* jcl *)
> >
> 
> sorry for the extremely slow reply John.  In your document, the 2nd
> issue you mention about IPC-7351 is that for things like 0603 packages,
> they embed capacitor/resistor/etc into the name.  That's done, I
> believe, because of the differing heights of those components.
> 
> -Dan
> 
>