Re: gEDA-user: thermal vias in pcb

To: "gEDA user mailing list" <geda-user@xxxxxxxxxxxxxx>

Subject: Re: gEDA-user: thermal vias in pcb

From: "joe tarantino" <joeft@xxxxxxxxxxxxx>

Date: Wed, 7 Mar 2007 09:30:02 -0800

Delivered-to: archiver@seul.org

Delivered-to: geda-user@moria.seul.org

Delivery-date: Wed, 07 Mar 2007 12:58:14 -0500

Dkim-signature: a=rsa-sha1; c=relaxed/relaxed; d=gmail.com; s=beta; h=domainkey-signature:received:received:message-id:date:from:sender:to:subject:in-reply-to:mime-version:content-type:references:x-google-sender-auth; b=BgvhPu867zyUZz1C1ezw31gRtuiv32AoMgfvYvn9Ucp3oHlz1Tbt5FTQq3HbYsT1T97onbKhDE/LjC5bLlFVwDCx2RZqeFfSd8wqg1crXJKY8nDUse2murOmG/sj06lIz7q02sD64XCeuXfhDjQgOJo+a+oDYzsIvG6K21AXSO0=

Domainkey-signature: a=rsa-sha1; c=nofws; d=gmail.com; s=beta; h=received:message-id:date:from:sender:to:subject:in-reply-to:mime-version:content-type:references:x-google-sender-auth; b=mDLEtapoYiwXW1ocW4I82uHFIE4nV1dw+DtaqlhXmDa4/e/ybiYUBW93OUViSiasXhjss/R98TxcbqR5eCGkLtaG5U3ETTtvYh4JbNNaCeiL5miOKf3pjDpAV0qbbtccCYYDofrm52YR+iUcZjutnaY6vLHcCjuaVGAeDOAcaPY=

In-reply-to: <1173266128.2756.47.camel@eng9177>

List-archive: <http://www.seul.org/pipermail/geda-user>

List-help: <mailto:geda-user-request@moria.seul.org?subject=help>

List-id: gEDA user mailing list <geda-user.moria.seul.org>

List-post: <mailto:geda-user@moria.seul.org>

List-subscribe: <http://www.seul.org/cgi-bin/mailman/listinfo/geda-user>, <mailto:geda-user-request@moria.seul.org?subject=subscribe>

List-unsubscribe: <http://www.seul.org/cgi-bin/mailman/listinfo/geda-user>, <mailto:geda-user-request@moria.seul.org?subject=unsubscribe>

References: <45EE5576.3000803@arrl.net> <1173266128.2756.47.camel@eng9177>

Reply-to: gEDA user mailing list <geda-user@xxxxxxxxxxxxxx>

Sender: geda-user-bounces@xxxxxxxxxxxxxx

On 3/7/07, Peter Baxendale <peter.baxendale@xxxxxxxxxxxx> wrote:

On Tue, 2007-03-06 at 22:02 -0800, Dave N6NZ wrote:
> What is the easiest way to create "thermal vias"? Not a via with a
> thermal relief -- I can do that :) .. but a via with no thermal relief
> punched into polygons on both sides of the board that ends up getting
> filled with solder to help create a large thermal mass to be used as a
> heat sink.
I thought you just put a thermal relief on the via and then shift
clicked on it to cycle through to the one with no relief. Or isn't that
what you meant?

_______________________________________________
geda-user mailing list
geda-user@xxxxxxxxxxxxxx
http://www.seul.org/cgi-bin/mailman/listinfo/geda-user

Depends on how new your version of PCB is. Peter's suggestion is appropriate for recent releases since this feature was added not too long ago. I'm running 20060822. If Dave is using an older version, then my suggestion is appropriate.

Joe T

_______________________________________________ geda-user mailing list geda-user@xxxxxxxxxxxxxx http://www.seul.org/cgi-bin/mailman/listinfo/geda-user