Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

[John Griessen <john@xxxxxxxxxxxxxx>]

DJ Delorie wrote:
>>   I would think that mounting the chip upside down 
.
.
.
  I suppose you could hand-solder some copper foil or
> desolder braid to the pad, as long as you're careful to not short the
> pins.


Then it would look like a dead, gutted bug.

I'm going to look into methods of dealing with BGAs in prototypes
since Bill's tech says they're less trouble after a learning curve.

I've heard and can imagine the way they pull themselves to alignment
by surface tension between the grid of chip balls and the grid of lands on the pcb.

John


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