Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

[John Griessen <john@xxxxxxxxxxxxxx>]

I'm going to look into methods of dealing with BGAs in prototypes
since Bob's tech says they're less trouble after a learning curve.

I've heard and can imagine the way they pull themselves to alignment
by surface tension between the grid of chip balls and the grid of lands on the pcb.

Do BGAs use zones of balls to dissipate heat?

John



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