Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

[Bob Paddock <bob.paddock@xxxxxxxxx>]

On Tue, Apr 28, 2009 at 3:58 PM, John Griessen <john@xxxxxxxxxxxxxx> wrote:
>
> I'm going to look into methods of dealing with BGAs in prototypes
> since Bob's tech says they're less trouble after a learning curve.

http://www.amazon.com/BGA-Breakouts-routing-Effective-Methods/dp/1438255233/ref=sr_1_1?ie=UTF8&s=books&qid=1239117189&sr=8-1


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