[Author Prev][Author Next][Thread Prev][Thread Next][Author Index][Thread Index]

Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?

To: gEDA user mailing list <geda-user@xxxxxxxxxxxxxx>
Subject: Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
From: Stefan Salewski <mail@xxxxxxxxxxxx>
Date: Wed, 29 Apr 2009 13:52:31 +0200
Delivered-to: archiver@xxxxxxxx
Delivered-to: geda-user@xxxxxxxxxxxxxx
Delivery-date: Wed, 29 Apr 2009 07:53:53 -0400
In-reply-to: <20090429091123.GB28250@xxxxxxx>
List-archive: <http://www.seul.org/pipermail/geda-user>
List-help: <mailto:geda-user-request@moria.seul.org?subject=help>
List-id: gEDA user mailing list <geda-user.moria.seul.org>
List-post: <mailto:geda-user@moria.seul.org>
List-subscribe: <http://www.seul.org/cgi-bin/mailman/listinfo/geda-user>, <mailto:geda-user-request@moria.seul.org?subject=subscribe>
List-unsubscribe: <http://www.seul.org/cgi-bin/mailman/listinfo/geda-user>, <mailto:geda-user-request@moria.seul.org?subject=unsubscribe>
References: <49F755EA.4080800@xxxxxxxxxxx> <4a9de0ba0904281221w6f7105b1jeedaa69c7bb8dd9a@xxxxxxxxxxxxxx> <49F75991.4010307@xxxxxxxxxxx> <200904281942.n3SJglB9017901@xxxxxxxxxxxxxxxx> <49F75F57.9030809@xxxxxxxxxxxxxx> <20090429091123.GB28250@xxxxxxx>
Reply-to: gEDA user mailing list <geda-user@xxxxxxxxxxxxxx>
Sender: geda-user-bounces@xxxxxxxxxxxxxx

On Wed, 2009-04-29 at 11:11 +0200, Gabriel Paubert wrote:
>  With a BGA, it will be hundreds of 
> points pulling themselves into alignment. But I don't see how you
> are going to put the solder paste without a stencil.
> 
> 	Gabriel

I think BGA devices, if soldered for the first time, need only flux, no
solder paste. The pins already have some tin on it.





_______________________________________________
geda-user mailing list
geda-user@xxxxxxxxxxxxxx
http://www.seul.org/cgi-bin/mailman/listinfo/geda-user

Follow-Ups:
- Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
  - From: DJ Delorie

References:
- Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
  - From: William Estrada
- Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
  - From: joe tarantino
- Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
  - From: William Estrada
- Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
  - From: DJ Delorie
- Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
  - From: John Griessen
- Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
  - From: Gabriel Paubert

Prev by Author: Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
Next by Author: Re: gEDA-user: Change text font size in PCB
Previous by thread: Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
Next by thread: Re: gEDA-user: OT: soldering QFN packages with exposed bottom pad?
Index(es):
- Author
- Thread