Re: gEDA-user: [pcb] overlapping pin/pad -- won't form thermal

[joeft <joeft@xxxxxxxxxxxxx>]

Ben Jackson wrote:
> On Tue, Mar 11, 2008 at 08:39:31AM -0800, Dave N6NZ wrote:
>> Steve Meier wrote:
>>> I am also interested in why you would want a thermal for connecting a
>>> via onto a pad in which the via is sitting.
>> ?? OK, I'm still under-caffeinated, but I don't parse your question. 
>> I'm guessing you missed my initial rant?  What I was trying to do is 
>> create an oblong pin to ease hand soldering.  So I created a pad 
>> overlapping a pin to create the desired shape.  The whole effort 
>> foundered because pcb won't create thermals on the resulting oblong pins 
>> -- pcb give the pin a thermal flag, but the thermal doesn't render 
>> because of the overlapping pad.
> 
> You can't thermal it to a surface layer, but you can thermal it to an
> inner layer.  You've always had to draw lines to pads to connect to any
> surface polygons.
> 

I think that what this implies is that you can't build a plane layer on 
the outside of a board )like an outside ground plane) with PCB?  I used 
to do this all the time with other tools when designing RF circuits. 
Connecting up a bunch of polygons sounds a little tedious.

Joe T


_______________________________________________
geda-user mailing list
geda-user@xxxxxxxxxxxxxx
http://www.seul.org/cgi-bin/mailman/listinfo/geda-user