Re: gEDA-user: General Layers questions

[DJ Delorie <dj@xxxxxxxxxxx>]

> If you mean 'physical layer' by 'composite', than yes. Each of those
> will have it's 'outline' layer.

I meant sub-assemblies.

This is hard to describe because of the near-impossible list of things
we want to support, but...

There are two types of sub-assemblies.  First, composite objects which
are mapped to the physical board, and second, the physical board
itself.

So, a footprint is a composite sub-assembly that includes some holes,
copper, cutouts, etc.  It needs to be mapped to the physical board
on-the-fly as we want to maintain it as "an object".  But the PCB
itself could have different numbers of layers at different locations,
such as flex cable assemblies, and you could describe the stackup
itself in terms of how the layers are put together (i.e. buried vias
are drilled through a subset of layers, that subset has its own
"holes" layer).

In both cases, there's information about holes that applies to some
subset of the layout.


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