Re: gEDA-user: "soldermask via caps"

[Armin Faltl <armin.faltl@xxxxxx>]

In that case considering all the above suggestions
I'd use a pad with 2 big (say 1.5mm) vias for the
die and solder from solder-side, then conventionally
solder all the through-hole pins.

To keep the part in place, either solder 2-4 pins before
the bottom and press it to the board while reheating the pins
or just support the board on the chip.

If you want to use a hot plate, maybe an iron distance below
the chip that clears the pins does the trick.

Dietmar Schmunkamp wrote:
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> Am 22.05.2010 01:28, schrieb DJ Delorie:
>   
> > For soldering QFNs at home, I think the easiest way (i.e. the least
> > amount of stuff to buy) is to pre-solder all the pads (center and
> > outside) on the pcb, so you know you have just the right amount of
> > solder on all of them.  Then put some flux on them and the part, put
> > the part on the solder, and reflow it with a $20 hotplate from Target.
> >
> > No paste, no funny vias, no special soldering irons.
> >
> >
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> >
> >     
> DJ,
> thanks a lot.
>
> That sounds interesting, does this work for a 12-Lead Plastic MSOP,
> Exposed Die Pad which has "conventional pins" (the exposed die may be up
> to 10 mil above the board) as well?
> One option for me may be to change to a DFN package where all pins are
> under the IC in one plane. I choose the MSOP to only have 1 problem
> (exposed pad only), not 13 (for all of the pins, including the exposed
> pad), but now I think it was the wrong decision. It's easier to deal
> with 13 similiar problems compared to 1 big problem.
>
> - -- 
>
> Mit freundlichen Gruessen
>
> Dietmar Schmunkamp
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