Re: gEDA-user: gEDA and PCB ------

[Karel Kulhavý <clock@twibright.com>]

On Thu, Oct 07, 2004 at 10:37:34PM -0400, DJ Delorie wrote:
> 
> > 8 layer board which really isn't enough.... time to get PCB to have a 
> > reasonable number of layers... yes yes i know it will be a lot of work.
> 
> We were just talking about this yesterday.  I have some ideas about
> implementing it.  I think the tricky part is deciding how many layers
> to allow, or if it needs to be dynamic, and if so, how do you adjust
> the number of layers?
> 
> > Yes very complex boards can be built with these tools but it isn't easy. 
> > Next generation BGA will probably require buiried vias, blind vias and 
> > micro vias. Boards of upto 40 layers have been built by the shop I 
> > normally use (not designed with geda and pcb).
> 
> I know the thing *I* am missing for blind and buried vias is... how do
> you specify them in the gerber files?

How are these being manufactured? I suppose every double-layer is being drilled
independently. So the legacy drill file could be for the holes that go through
and then, if buried and blind vias are present, there could be files for each
double-layer of the stack.

I don't know what micro vias are. What are they?

Cl<