As long as we are on this topic. the solder mask should be part of the pad stack.I have some parts/and designs that requite unmasked via's and shapes. spark gap for extreme over voltage in power supplies.
Not having a true solder mask layer in pcb is a limitation.overall i see this thread as a request to add non-copper layers to footprints.
we could start sneaking in a keep out layer. :-) On Oct 15, 2007, at 3:07 PM, Dave N6NZ wrote:
DJ Delorie wrote:Imagine, that you have a 431 pin BGA. Would you include 431 times the same padstack in the footprint? I think one should bother with the whatever shape, and size of the stencil, copper, mask, paste layers. Those are just "pads". Then we could link pads to a padstack, and the padstacks into the footprint.For sanity's sake, let's let a footprint define its pad stacks for itsown pads, rather than trying to maintain a global cache of padstacks. Then, a BGA footprint would have one "here's what my pads look like" and 431 copies of "put one here".Yup. Right answer. A footprint needs to be entirely self-contained. -dave _______________________________________________ geda-user mailing list geda-user@xxxxxxxxxxxxxx http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
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