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Re: gEDA-user: next PCB release - 1.99za vs 4.0

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Subject: Re: gEDA-user: next PCB release - 1.99za vs 4.0
From: DJ Delorie <dj@xxxxxxxxxxx>
Date: Sun, 12 Sep 2010 16:06:34 -0400
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In-reply-to: <20100912200139.727181002F09E@xxxxxxxxxxxxxx> (message from Rick Collins on Sun, 12 Sep 2010 16:01:27 -0400)
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> Bigger???  Why do you need an annulus on an inner layer that doesn't 
> connect to a trace?

Depending on the fab technique, you may need an annulus just to fill
the gap between fr4 layers so that the electroplating is reliable.
Either that, or you need to keep *other* copper far enough away that
the prepreg can fill the gap.


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Follow-Ups:
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: Rick Collins

References:
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: Bob Paddock
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: John Griessen
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: Bob Paddock
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: Andrew Poelstra
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: DJ Delorie
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: Andrew Poelstra
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: DJ Delorie
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: Andrew Poelstra
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: Bob Paddock
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: DJ Delorie
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: Andrew Poelstra
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: DJ Delorie
- Re: gEDA-user: next PCB release - 1.99za vs 4.0
  - From: Rick Collins

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