On Thu, Nov 18, 2010 at 10:01 PM, kai-martin knaak <kmk@xxxxxxxxxxxxxxx> wrote:
Looks like there is no open 3D exchange format that fits the
need of pcb:
a) render a beautiful image of a populated board
b) integrate pcb in a 3D work-flow to fit the board into some
tight space.
The existing formats are either limited to surfaces rather than objects
(STL, VRML). This prevents efficient processing of the 3D geometry.
Or they lack attributes for eye candy (IGES). Or they are overly
complex and geared to completely different use cases (STEP)
Not knowing anything of which I speak (write?), would COLLADA
(https://collada.org/mediawiki/index.php/COLLADA_-_Digital_Asset_and_FX_Exchange_Schema)
fit the bill?