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Re: gEDA-user: pcb flip-sides

In the photo you included, the physical stackup would be:

component
solder
outline
GND
power
signal1
signal2
signal3

Note that the lesstif HID uses the same type of layout grid.

If you're iterating from 0..max_layers, just use it as the array index
into PCB->LayerGroups.Entries[].  The only catch is, if the component
group is *after* the solder group in the list, you iterate backwards.


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