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Re: gEDA-user: next PCB release - 1.99za vs 4.0



DJ Delorie <dj@xxxxxxxxxxx> writes:

>> And I think the only way to do ... in a non-kludgy way
>
> Yet another example of you automatically putting down any idea that
> isn't yours.  Please stop that.  Please consider the possibility that
> someone might come up with a better (or even equally good) idea than
> yours.  Constructive criticism is welcome.  Implied insults are not.
>
>> is to treat the insulating planes as layers, each with its own
>> geometry.
>
> So, you're saying drills and outlines should be stored on "insulator"
> drawing layers and the "conductor" drawing layers should only contain
> the actual conductor shapes?

For maximum felixibility, probably yes, but that need not be a required
part of a layout.  Just like the current outline layer (kludge) is not a
requirement.

I have done a rigid-flex board with three outline layers.  Rigid,
thick(four layer) flex, thin (two-layer) flex.  And, yes, that was a bit
kludgy.  The board-house had to ignore all those vias in the outline
gerbers. 

But I assume the current discussion is going exacly in the right
direction.  Add three layers, name them properly, mark them
non-conductive, and draw the outlines, done.

What is missing in this case of multiple types of conductors that
connect without vias, is the gerber export of layer-subgroups.  Current
PCB can do that with an sed one-liner in the Makefile.  Not too bad a
kludge for such an exotic case, but still a kludge.  Solution: separate
conductor layer grouping and export layer grouping.  Without telling the
GUI users about the distiction unless the GUI is in Expert-Mode.

-- 
Stephan BÃttcher                     FAX: +49-431-880-3968
Extraterrestrische Physik            Tel: +49-431-880-2508
I.f.Exp.u.Angew.Physik               mailto:boettcher@xxxxxxxxxxxxxxxxxx
Leibnizstr. 11, 24118 Kiel, Germany


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